DESCRIPTION

By using different types of sensors, microprocessors and communication interfaces to detect the operating status of the machine, the capture and placement of chips can be accurately calibrated and monitored during the production process, thereby increasing the manufacturing yield. The chip operation process can be monitored and corrected during the production process in a vacuum environment.

KEY FEATURES

• ●  Accuracy ：Horizontal accuracy:±0.03 deg within ±1%from absolute.

• ●  Highly accurate - vibration ：Operating range: ±4 GOperating range: ± 2G

• ●  Power source ： Battery

• ●  Durable housing ： Carbon fiber composite

• ●  Communication ： RF

• ●  Recording Time min ： <1 Hour (12.5S/s)

• ●  Calibration ： Factory recalibration recommended annually